Company Filing History:
Years Active: 2024
Title: Mariko Teshiba: Innovator in Semiconductor Processing Adhesives
Introduction
Mariko Teshiba is a prominent inventor based in Ibaraki, Japan. She has made significant contributions to the field of semiconductor processing through her innovative work on pressure-sensitive adhesive sheets. Her inventions are designed to enhance the efficiency and effectiveness of semiconductor wafer processing.
Latest Patents
Mariko Teshiba holds a patent for a pressure-sensitive adhesive sheet specifically tailored for semiconductor wafer processing. This invention is notable for its excellent adhesiveness with semiconductor wafers, light peelability, and ability to suppress adhesive residue. The adhesive sheet comprises a base material, an intermediate layer, and a UV-curable pressure-sensitive adhesive layer. The intermediate layer exhibits a storage modulus of elasticity at room temperature, G′1, ranging from 300 kPa to 2,000 kPa, and at 80° C., G′1, from 10 kPa to 500 kPa. The UV-curable pressure-sensitive adhesive layer has a storage modulus of elasticity at room temperature, G′2, from 100 kPa to 1,000 kPa, and at 80° C., G′2, from 10 kPa to 1,000 kPa. The relationship G′1/G′2 is maintained at 1 or more, ensuring optimal performance.
Career Highlights
Mariko Teshiba is currently employed at Nitto Denko Corporation, where she continues to develop innovative solutions in the field of adhesive technologies. Her work has garnered attention for its practical applications in the semiconductor industry, contributing to advancements in manufacturing processes.
Collaborations
Mariko collaborates with her coworker, Hiroki Kono, who plays a vital role in supporting her research and development efforts. Together, they work on projects that aim to push the boundaries of adhesive technology in semiconductor processing.
Conclusion
Mariko Teshiba's contributions to the field of semiconductor processing adhesives highlight her innovative spirit and dedication to advancing technology. Her patent for a pressure-sensitive adhesive sheet exemplifies her commitment to improving manufacturing processes in the semiconductor industry.