The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2024
Filed:
Jun. 21, 2022
Nitto Denko Corporation, Ibaraki, JP;
Mariko Teshiba, Ibaraki, JP;
Hiroki Kono, Ibaraki, JP;
NITTO DENKO CORPORATION, Ibaraki, JP;
Abstract
Provided is a pressure-sensitive adhesive sheet for semiconductor wafer processing that is excellent in adhesiveness with a semiconductor wafer, and that has light peelability and suppresses adhesive residue. The pressure-sensitive adhesive sheet for semiconductor wafer processing includes in this order: a base material; an intermediate layer; and a UV-curable pressure-sensitive adhesive layer. The intermediate layer has a storage modulus of elasticity at room temperature, G′1, of from 300 kPa to 2,000 kPa, and a storage modulus of elasticity at 80° C., G′1, of from 10 kPa to 500 kPa. The UV-curable pressure-sensitive adhesive layer has a storage modulus of elasticity at room temperature, G′2, of from 100 kPa to 1,000 kPa, and a storage modulus of elasticity at 80° C., G′2, of from 10 kPa to 1,000 kPa. G′1/G′2is 1 or more.