Osaka, Japan

Mariko Omori

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignees: Asahi Kasei Advance Corporation, Kaji Nylon .Inc, Osaka Research Institute of Industrial Science and Technology. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mariko Omori. Retrieved from https://idiyas.com/inventor/mariko-omori

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2026

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Mariko Omori: Inventor of a Practical Sensing Fiber

Introduction

Mariko Omori is an inventor associated with Osaka, Japan. Her work includes a sensing fiber designed to combine practical manufacturing, flexibility, and lower cost.

Latest Patents

Omori is named on 1 patent, titled “Sensing fiber member.” The invention uses at least two covered yarns, each made by wrapping insulating fiber around a linear conductor. Placed close together, the conductors enable sensing through changes in resistance and/or capacitance between them. The design is intended to support long-length processing and mass production while remaining supple, comfortable in texture, and less costly than conventional contact-sensing fibers made with piezoelectric materials.

Career Highlights

Omori’s listed professional affiliations include the Osaka Research Institute of Industrial Science and Technology and Asahi Kasei Advance Corporation. Her patent reflects an effort to develop sensing technology that can be manufactured efficiently and incorporated into flexible fiber products.

Collaborations

Shigeru Morita and Kansei Yoshimura are listed as Omori’s coworkers.

Conclusion

Mariko Omori’s sensing-fiber invention brings together conductive yarn construction and resistance- or capacitance-based sensing, with an emphasis on scalable production, flexibility, and affordability.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…