San Jose, CA, United States of America

Mariia Gorchichko

This inventor holds 1 USPTO granted patent and 4 published patent applications. Top assignee: Applied Materials, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mariia Gorchichko. Retrieved from https://idiyas.com/inventor/mariia-gorchichko

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Mariia Gorchichko: Inventor in Substrate Processing

Introduction

Mariia Gorchichko is an inventor based in San Jose, California, and works at Applied Materials, Inc. Her patent work addresses substrate processing, including techniques for handling bowed substrates.

Latest Patents

Gorchichko is associated with 1 patent: “Methods and Apparatus for Chucking a Bowed Substrate.” The invention describes a substrate processing system with a pedestal containing multiple chucking regions, sensors that detect substrate warpage, and adjustable chucking components. These components can apply different amounts of force, heating, or cooling based on the detected warpage.

Career Highlights

Her listed invention focuses on adapting substrate support to the substrate’s shape. By adjusting chucking conditions in response to detected warpage, the system is designed to facilitate substrate processing.

Collaborations

Gorchichko’s listed coworkers include Joshua Stuart Holt and Shubhendra Kumar Jain. The patent information connects their work to substrate chucking and processing systems.

Conclusion

Mariia Gorchichko’s patent work at Applied Materials, Inc. concerns adjustable methods for chucking bowed substrates, with the aim of responding to substrate warpage during processing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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