Myjava, Slovakia

Marián Cintula

This inventor holds 1 USPTO granted patent. Top assignee: Schaeffler Technologies Ag & Co. Kg. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Marián Cintula. Retrieved from https://idiyas.com/inventor/marian-cintula-5ncozai9

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Marián Cintula and His Planet Carrier Assembly Patent

Introduction

Marián Cintula is an inventor associated with Myjava, Slovakia. His patent work includes an invention concerning a planet carrier assembly and the connection between its carrier and carrier flange.

Latest Patents

Cintula is credited with 1 patent: “Planet Carrier Assembly, Shaft-Hub Connection, and Method for Producing the Shaft-Hub Connection Between a Carrier Flange and a Carrier from the Planet Carrier Assembly.”

The invention describes a carrier and carrier flange with circumferentially spaced driver elements that interlock at shared contact areas. Plastically deformed material secures the flange axially to the carrier, with the material displaced from one set of driver elements or the other. The design addresses the connection and production of components in a planet carrier assembly.

Career Highlights

Cintula is associated with Schaeffler Technologies AG & Co. KG. His patent reflects work on mechanical assemblies and shaft-hub connection methods.

Collaborations

Manuel Seubert and Ralph Schimpf are identified as Cintula’s coworkers.

Conclusion

Marián Cintula’s patent documents an interlocking, plastically secured connection for a planet carrier assembly, highlighting his contribution to mechanical engineering innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…