Halmstad, Sweden

Maria Törnblom

This inventor holds 1 USPTO granted patent and 5 published patent applications and 4 EPO patents. Top assignee: Stora Enso Oyj. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Maria Törnblom. Retrieved from https://idiyas.com/inventor/maria-törnblom

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Maria Törnblom and Porous Fiber Packaging Innovation.

Introduction

Maria Törnblom is an inventor associated with Halmstad, Sweden, and Stora Enso Oyj. Her listed patent concerns a molded packaging product designed to cushion and insulate packaged goods.

Latest Patents

Törnblom is associated with 1 patent, titled “3D Shaped Packaging Product from an Air-Laid Blank.” The invention describes hot-pressing an air-laid blank made primarily of natural fibers, with a thermoplastic polymer binder, into a three-dimensional form. The process uses an average pressure of no more than 200 kPa, and the resulting product retains a significant portion of the blank’s porosity. This structure is intended to provide shock absorption, damping, and thermal insulation while keeping the product’s density within the specified range.

Career Highlights

The patent reflects work on fiber-based packaging that combines molded shapes with cushioning and insulation performance. Its approach preserves porosity during forming, a feature central to the product’s stated protective properties.

Collaborations

The supplied information lists Martin Malmqvist and Thomas Pfitzner as Törnblom’s coworkers. The patent is associated with Stora Enso Oyj.

Conclusion

Maria Törnblom’s listed patent highlights a porous, natural-fiber packaging design intended to protect goods through cushioning and thermal insulation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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