This inventor holds 2 USPTO granted patents and 1 EPO patent. Top assignee: Other. Active years: 2009-2011.
Company Filing History:
Years Active: 2009-2011
Title: Maria Nikolova: Innovator in Copper Electroplating Technologies
Introduction
Maria Nikolova is a prominent inventor based in Waterbury, CT (US). She has made significant contributions to the field of electroplating, particularly in the development of innovative copper plating solutions. With a total of 2 patents, her work has advanced the technology used in various applications, including printed circuit boards.
Latest Patents
Maria's latest patents include an "Acid copper electroplating bath composition" and a "Process for electrolytically plating copper." The acid copper electroplating composition features an improved additive system designed for use at elevated temperatures. This system includes a suppressor made of high molecular weight polymer, a brightener consisting of divalent sulfur compounds, and a leveler based on a heterocyclic nitrogen compound. This composition is particularly effective for plating through holes in printed circuit boards. The electrolytic copper plating process she proposed consists of two steps, making it suitable for plating in confined spaces. The first step involves a pre-treatment solution with an anti-suppressor containing a sulfur-based organic compound, while the second step utilizes an electrolytic copper plating solution based on alkane sulfonic acid.
Career Highlights
Throughout her career, Maria has worked with notable companies, including Macdermid, Incorporated. Her expertise in electroplating has positioned her as a key figure in the industry, contributing to advancements that enhance manufacturing processes.
Collaborations
Maria has collaborated with esteemed colleagues such as James Watkowski and Gary B Larson. Their combined efforts have fostered innovation and development in the field of electroplating.
Conclusion
Maria Nikolova's contributions to copper electroplating technologies demonstrate her commitment to innovation and excellence. Her patents reflect a deep understanding of the complexities involved in electroplating processes, paving the way for future advancements in the industry.