This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Texas Instruments Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Marcus Rudolf Zimnik and Semiconductor Packaging Innovation.
Introduction
Marcus Rudolf Zimnik is an inventor associated with Wuppertal, Germany. His patent work includes an invention concerning semiconductor packages and welding interfaces.
Latest Patents
Zimnik is credited with 1 patent: “Semiconductor Packages Including Interface Members for Welding.” The patent addresses interface members used in semiconductor packages and their role in welding.
Career Highlights
Zimnik is associated with Texas Instruments Incorporated. His recorded patent activity reflects a contribution to semiconductor packaging technology.
Collaborations
Tobias Bernhard Fritz is listed as Zimnik’s coworker. The available information identifies their professional association but does not specify further details about their collaboration.
Conclusion
Marcus Rudolf Zimnik’s recorded invention focuses on semiconductor packaging, with an interface-member design for welding forming the central subject of his patent.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile