Columbus, OH, United States of America

Marcelo Dapino

This inventor holds 2 USPTO granted patents. Top assignee: The Ohio State University. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Marcelo Dapino. Retrieved from https://idiyas.com/inventor/marcelo-dapino

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 3.0


Company Filing History:


Years Active: 2026

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2 patents (USPTO):Explore Patents

Title: Marcelo Dapino: Inventor in Advanced Manufacturing and Coupling Systems.

Introduction

Marcelo Dapino is an inventor based in Columbus, Ohio, and is associated with The Ohio State University. His work includes inventions in ultrasonic additive manufacturing and vehicle occupant restraint systems. He holds 2 patents.

Latest Patents

“Systems and Methods for Joining and Repair Using Ultrasonic Additive Manufacturing with a Contoured Sonotrode” describes an ultrasonic additive manufacturing system with a rotating sonotrode, transducers that vibrate it, and a contoured welding surface. The sonotrode and base structure can translate relative to one another, supporting joining and repair processes.

“Bayonet Coupler and Vehicle Occupant Restraint System for Use Therein” describes a connector with interlocking male and female engagement structures. Their geometry creates a greater axial length farther from the central axis than closer to it, for use in a vehicle occupant restraint system.

Career Highlights

Dapino’s patent work spans manufacturing technology and mechanical coupling design. His association with The Ohio State University connects his inventive work with a major research institution.

Collaborations

His listed coworkers include Leon Headings and Vivek Srinivas.

Conclusion

Marcelo Dapino’s patents reflect contributions to ultrasonic additive manufacturing and vehicle restraint-system components, alongside his work associated with The Ohio State University.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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