Leinfelden-Echterdingen, Germany

Marc Spies

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Tesat-Spacecom Gmbh & Co Kg. Active years: 2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Marc Spies. Retrieved from https://idiyas.com/inventor/marc-spies

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

 

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2018

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1 patent (USPTO):Explore Patents

Title: Marc Spies and His High-Voltage Connector Patent.

Introduction

Marc Spies is an inventor based in Leinfelden-Echterdingen, Germany. His patent work includes an invention designed to create a stable, interference-resistant connection between high-voltage lines.

Latest Patents

The available information lists one patent for Marc Spies: High voltage connector. The invention describes a carrier element made from high-voltage insulating material, with two parallel guiding grooves running along its length. Each groove accommodates a wire from one of the two high-voltage lines being connected. The design aims to provide a mechanically stable connection that resists electrical interference and can operate under critical pressure conditions.

Career Highlights

Spies is associated with Tesat-Spacecom GmbH & Co. KG. His listed patent reflects work on the practical challenges of connecting high-voltage lines reliably.

Collaborations

Günther Jaumann and Dieter Schneider are identified as Spies’s coworkers. The available information does not specify their roles in the patent or the extent of their collaboration.

Conclusion

Marc Spies’s listed invention focuses on a robust, insulated high-voltage connector, and his work is associated with Tesat-Spacecom GmbH & Co. KG.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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