Manny Tansavatdi

Title: Innovations by Manny Tansavatdi

Introduction

Manny Tansavatdi, an accomplished inventor based in Rancho Palos Verdes, California, has made significant contributions to the field of electronic packaging. With a total of two patents to his name, his innovative designs focus on improving the functionality and efficiency of electronic components in extreme environments.

Latest Patents

One of his most notable patents is the "Large Non-Hermetic Multichip Module Package." This invention introduces a novel packaging approach that allows for the integration of multiple multichip module technologies within a mechanically robust and thermally conductive package. The design includes removable and standard high-density multilayer interconnect substrates, featuring a reworkable chip on board coating. It also utilizes a metal substrate, connected through wire bonds to various electronic chips, ensuring a reliable interconnection for high-performance applications.

Another significant patent by Tansavatdi is the "Preheating Device for Electronic Circuits." This groundbreaking technology addresses the challenges of operating electronic components in extremely cold temperatures by embedding copper traces as heating elements. The system incorporates a control circuit to manage the power supply and maintain a predetermined temperature threshold, which enhances the reliability and performance of electronic boards in harsh conditions.

Career Highlights

Manny Tansavatdi is currently employed at Raytheon Company, where he continues to develop innovative solutions that enhance electronic capabilities. His work at Raytheon has positioned him as a leader in the field of electronic packaging, combining technical expertise with practical applications.

Collaborations

Throughout his career, Tansavatdi has collaborated with notable colleagues such as David T. Winslow and William D. Farwell. These partnerships have fostered a collaborative environment that encourages the creation of pioneering technologies, further enhancing the impact of their collective work in the industry.

Conclusion

Manny Tansavatdi's patents reflect his commitment to advancing electronic packaging technologies. His inventions demonstrate a keen understanding of the complexities involved in electronic component design and functionality. With a strong foundation in innovation and collaboration, Tansavatdi continues to influence the future of the electronics industry.