This inventor holds 1 USPTO granted patent. Top assignee: R.s.m. Electron Power, Inc.. Active years: 2017.
Company Filing History:
Years Active: 2017
Title: Manhong Zhao: Innovator in Multilayer Substrate Technology
Introduction
Manhong Zhao is a notable inventor based in New Hyde Park, NY (US). He has made significant contributions to the field of electronic packaging through his innovative patent. His work focuses on improving the reliability of electronic components by addressing thermal expansion issues.
Latest Patents
Manhong Zhao holds a patent for a multilayer substrate and the method for manufacturing it. The invention provides a slip layer substrate that reduces thermal residual stresses between components caused by mismatches in thermal expansion. This advancement greatly enhances the reliability of electronic packages. The slip layer substrate consists of a base material, a first metallization layer, a first diffusion barrier layer, a slip layer, a second diffusion barrier layer, and a second metallization layer.
Career Highlights
Manhong Zhao is currently employed at R.S.M. Electron Power, Inc. His work at the company has allowed him to focus on developing innovative solutions for electronic packaging challenges. His expertise in multilayer substrates has positioned him as a valuable asset in the industry.
Collaborations
Some of his coworkers include Ching Au and Robert Conte. Their collaboration contributes to the innovative environment at R.S.M. Electron Power, Inc.
Conclusion
Manhong Zhao's contributions to multilayer substrate technology exemplify his commitment to enhancing electronic packaging reliability. His innovative patent reflects his expertise and dedication to solving complex engineering challenges.