Berlin, Germany

Manfred Zaeske

This inventor holds 1 USPTO granted patent. Top assignee: Infineon Technologies Ag. Active years: 2004.


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2004

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1 patent (USPTO):Explore Patents

Title: Manfred Zaeske: Innovator in Electronic Device Packaging

Introduction

Manfred Zaeske is a notable inventor based in Berlin, Germany. He has made significant contributions to the field of electronic device packaging. His innovative approach has led to the development of a unique housing assembly that enhances the functionality and reliability of electronic devices.

Latest Patents

Zaeske holds a patent for a "Housing assembly for an electronic device and method of packaging an electronic device." This invention involves a housing assembly that forms a package for an electronic device. The assembly includes the electronic device, an external carrier, and a housing frame. A capillary-acting epoxy resin is filled into the assembled housing assembly via a filling-in opening. Due to its capillary action, the resin effectively closes the interspaces between the semiconductor chip and the housing frame. This innovation is crucial for ensuring the durability and performance of electronic devices.

Career Highlights

Manfred Zaeske is currently associated with Infineon Technologies AG, a leading company in semiconductor solutions. His work at Infineon has allowed him to focus on advancing technologies that improve electronic device packaging. With a patent portfolio that includes 1 patent, Zaeske continues to push the boundaries of innovation in his field.

Collaborations

Throughout his career, Zaeske has collaborated with several talented professionals, including Reinhard Fischbach and Manfred Fries. These collaborations have fostered an environment of creativity and innovation, leading to advancements in electronic device technology.

Conclusion

Manfred Zaeske's contributions to electronic device packaging exemplify the spirit of innovation. His patented work not only enhances the functionality of electronic devices but also showcases the importance of collaboration in technological advancements. His ongoing efforts at Infineon Technologies AG continue to inspire future innovations in the industry.

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