Wittenbach, Switzerland

Manfred Teichmann

This inventor holds 1 USPTO granted patent. Top assignees: Klasmann-Deilmann Gmbh, Spuhl Ag. Active years: 1993.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Manfred Teichmann. Retrieved from https://idiyas.com/inventor/manfred-teichmann-f1j45eey

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 1993

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Manfred Teichmann

Introduction

Manfred Teichmann is a notable inventor based in Wittenbach, Switzerland. He has made significant contributions to the field of agriculture through his innovative designs and patents. His work focuses on improving the efficiency of seedling growth and transportation.

Latest Patents

One of Teichmann's key inventions is a patent for molds designed for the growing of seedlings. This mold is composed of turf, water, nutrients, and a synthetic molding material. The dried mold retains the seedling during handling and transportation, allowing it to grow directly within the mold once planted and watered. This invention also encompasses the process and device for manufacturing such molds, showcasing his commitment to enhancing agricultural practices.

Career Highlights

Throughout his career, Manfred Teichmann has worked with several companies, including Spuhl AG and Klasmann-Deilmann GmbH. His experience in these organizations has contributed to his understanding of the agricultural industry and the needs of farmers.

Collaborations

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Conclusion

Manfred Teichmann's innovative approach to seedling growth and transportation has the potential to revolutionize agricultural practices. His patent reflects a deep understanding of the challenges faced by farmers and offers a practical solution to enhance efficiency.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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