Manfred Riesner

Title: Manfred Riesner: Innovator in Chip Web Technology

Introduction

Manfred Riesner is a notable inventor based in Rossdorf, Germany. He has made significant contributions to the field of chip web technology, particularly through his innovative patent that addresses the challenges of spreading chip webs effectively.

Latest Patents

Riesner holds a patent for a "Process and apparatus for spreading a chip web." This invention involves a method for spreading a chip web from a supply over a width that corresponds to the web width on a substrate moving below the supply. The process ensures that the spreading is accomplished according to a specified web height distribution transversely to the direction of web travel. The apparatus includes a rake-like distribution device and a distribution chute, which are strategically arranged to eliminate defects caused by delivery elements in the transverse distribution of the chip web. An arrangement of several rakes inclined toward one another is utilized to control the transverse chip distribution.

Career Highlights

Throughout his career, Riesner has been associated with Carl Schenck AG, where he has applied his expertise in developing advanced technologies for chip web applications. His work has been instrumental in enhancing the efficiency and effectiveness of chip spreading processes.

Collaborations

Riesner has collaborated with notable colleagues, including Walter Henschel and Uwe Kunstmann, contributing to the advancement of technology in their field.

Conclusion

Manfred Riesner's innovative work in chip web technology exemplifies the impact of dedicated inventors in advancing industrial processes. His contributions continue to influence the efficiency of chip spreading applications in various industries.