Nuremberg, Germany

Manfred Brückmann

This inventor holds 2 USPTO granted patents. Top assignees: Infineon Technologies Ag, Siemens Aktiengesellschaft. Active years: 2001-2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Manfred Brückmann. Retrieved from https://idiyas.com/inventor/manfred-branduumlckmann

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 2

Forward Citations = 27(Granted Patents)


Company Filing History:


Years Active: 2001-2003

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2 patents (USPTO):Explore Patents

Title: Manfred Brückmann: Innovator in Microelectronics

Introduction

Manfred Brückmann is a notable inventor based in Nürnberg, Germany. He has made significant contributions to the field of microelectronics, holding a total of 2 patents. His work focuses on innovative methods for producing microelectronic components, particularly those of sandwich construction.

Latest Patents

Brückmann's latest patents include a method for producing a microelectronic component of sandwich construction. This method involves several steps, such as providing a first substrate with a first conductor track plane and a plurality of semiconductor chips. The semiconductor chips have first contact faces that are electrically connected to the first conductor track plane, along with second contact faces that are opposite the first sides. The process also includes providing a second substrate with a second conductor track plane featuring contact points. Electrically conductive balls are secured to these contact points using a flexible adhesive. The method concludes with the joining of the first and second substrates together. His second patent describes a microelectronic component of sandwich construction, which consists of a first substrate and a second substrate, with multiple semiconductor chips positioned between them. The contacting of the second conductor track plane to the semiconductor chips is achieved through fixed contacting means, such as soldered connections or electrically conductive adhesive. These microelectronic components are particularly suitable for use as power components in applications like inverters.

Career Highlights

Throughout his career, Brückmann has worked with prominent companies in the technology sector, including Siemens Aktiengesellschaft and Infineon Technologies AG. His experience in these organizations has contributed to his expertise in microelectronics and innovation.

Collaborations

Brückmann has collaborated with notable colleagues, including Leo Lorenz and Michael Kaindl. These partnerships have likely enriched his work and contributed to the development of his patented technologies.

Conclusion

Manfred Brückmann is a distinguished inventor whose contributions to microelectronics have paved the way for advancements in the field. His innovative patents and collaborations reflect his commitment to enhancing technology in practical applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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