Kanagawa, Japan

Manabu Tsukuda

This inventor holds 1 USPTO granted patent. Top assignee: Sodick Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Manabu Tsukuda. Retrieved from https://idiyas.com/inventor/manabu-tsukuda

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Manabu Tsukuda: Innovator in Wire Electric Discharge Machining

Introduction

Manabu Tsukuda is a notable inventor based in Kanagawa, Japan. He has made significant contributions to the field of machining technology, particularly through his innovative designs and patents. His work focuses on enhancing the efficiency and precision of wire electric discharge machining.

Latest Patents

One of Tsukuda's key patents is for a wire electric discharge machining apparatus. This invention features an upper guide assembly that includes an upper wire guide, an upper power feed contact, and a power feed contact movement device. The lower guide assembly consists of a lower power feed contact. The design allows the upper and lower power feed contacts to contact the wire electrode, supplying power by moving horizontally from initial positions. The movement is based on a predetermined offset amount, which is set according to various machining conditions, including the state of the wire electrode and the workpiece.

Career Highlights

Tsukuda is associated with Sodick Co., Ltd., a company renowned for its advanced machining technologies. His role at Sodick has allowed him to contribute to the development of innovative machining solutions that are widely used in various industries.

Conclusion

Manabu Tsukuda's contributions to wire electric discharge machining exemplify the impact of innovation in manufacturing technology. His patent reflects a deep understanding of machining conditions and the need for precision in industrial applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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