Toyokawa, Japan

Manabu Takatsu


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2000

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1 patent (USPTO):Explore Patents

Title: Manabu Takatsu: Innovator in Thermal Shock Testing for Ceramics

Introduction

Manabu Takatsu is a notable inventor based in Toyokawa, Japan. He has made significant contributions to the field of materials testing, particularly focusing on ceramics. His innovative approach has led to the development of a unique apparatus designed to assess the thermal shock fracture strength of ceramic materials.

Latest Patents

Takatsu holds a patent for a "Method and apparatus for carrying out a thermal shock test on ceramics." This invention includes an apparatus that supports a ceramic test piece shaped as a rectangular parallelepiped. The apparatus features force-detecting means that restrain deformation of the ceramic test piece while it is subjected to thermal shock. The design allows for precise measurement of the forces acting on the ceramic, ensuring accurate testing of its thermal shock resistance.

Career Highlights

Manabu Takatsu is associated with Sintokogio, Ltd., a company known for its advancements in industrial testing equipment. His work has been instrumental in enhancing the reliability and accuracy of thermal shock testing methods. With a focus on innovation, Takatsu continues to push the boundaries of materials testing technology.

Collaborations

Throughout his career, Takatsu has collaborated with esteemed colleagues such as Shoji Uchimura and Hirohide Ishiguro. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and expertise in the field of ceramics testing.

Conclusion

Manabu Takatsu's contributions to the field of thermal shock testing for ceramics exemplify his dedication to innovation and excellence. His patented apparatus represents a significant advancement in materials testing, ensuring that ceramics can be evaluated for their performance under thermal stress.

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