This inventor holds 1 USPTO granted patent. Top assignee: Threebond Co., Ltd.. Active years: 1992.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1992
Title: Manabu Nakamura: Innovator in Wire Splicing Technology
Introduction
Manabu Nakamura is a notable inventor based in Kanagawa, Japan. He has made significant contributions to the field of wire splicing technology. His innovative approach has led to the development of a unique apparatus that enhances the efficiency of splicing and sealing conductive wires.
Latest Patents
Nakamura holds a patent for a device titled "Means for Splicing Wires." This invention provides an apparatus for splicing and sealing multiple conductive wires. The design includes a support member and a flexible sealant contained within the support member. The method outlined in the patent offers a reliable way to splice and seal wires, ensuring durability and effectiveness.
Career Highlights
Manabu Nakamura is associated with Threebond Co., Ltd., a company known for its advancements in adhesive technologies. His work at Threebond has allowed him to focus on innovative solutions that address industry needs. With a patent portfolio that includes 1 patent, he continues to contribute to the field of electrical engineering.
Collaborations
Nakamura has collaborated with talented individuals such as Ikuzo Usami and Yoshinori Sato. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
In summary, Manabu Nakamura is a distinguished inventor whose work in wire splicing technology has made a significant impact. His patent for splicing wires showcases his innovative spirit and dedication to improving electrical engineering practices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile