Kanagawa, Japan

Manabu Itsumi

This inventor holds 1 USPTO granted patent. Top assignee: Nippon Telegraph and Telephone Corporation. Active years: 2001.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Manabu Itsumi. Retrieved from https://idiyas.com/inventor/manabu-itsumi-hyva5yzb

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 13(Granted Patents)


Company Filing History:


Years Active: 2001

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1 patent (USPTO):Explore Patents

Title: Manabu Itsumi: Innovator in Semiconductor Technology

Introduction

Manabu Itsumi is a notable inventor based in Kanagawa, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the manufacturing processes of semiconductor devices.

Latest Patents

His most recent patent is titled "Method of manufacturing semiconductor device having reinforcing member and method of manufacturing IC card using the device." This innovative method involves bonding a reinforcing plate to the lower surface of a semiconductor substrate, which has integrated circuits formed on its major surface. After bonding, the reinforcing plate is cut into units of integrated circuit chips, creating a reinforcing member for each chip.

Career Highlights

Manabu Itsumi is associated with Nippon Telegraph and Telephone Corporation, where he has been instrumental in advancing semiconductor manufacturing techniques. His work has paved the way for improved durability and functionality in integrated circuits.

Collaborations

He has collaborated with notable colleagues, including Hideyuki Unno and Shin-ichi Ohfuji, contributing to various projects that enhance semiconductor technology.

Conclusion

Manabu Itsumi's innovative approach to semiconductor manufacturing exemplifies the importance of research and development in technology. His contributions continue to influence the industry and pave the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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