Tokyo, Japan

Manabu Harazono

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Jfe Steel Corporation. Active years: 2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Manabu Harazono. Retrieved from https://idiyas.com/inventor/manabu-harazono

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: Manabu Harazono - Innovator in Cutting Equipment for Steel Strips

Introduction

Manabu Harazono is an inventor based in Chiyoda-ku, Tokyo, Japan. He has made significant contributions to the field of cutting equipment, particularly for steel strips. His innovative approach focuses on enhancing the efficiency and precision of cutting processes in industrial applications.

Latest Patent Applications

Harazono's notable patent application is for cutting equipment designed specifically for steel strips. This equipment includes a cutting device that utilizes laser technology to cut the vicinity of a joint portion where two steel strips are joined. The cutting device is equipped with a joint portion detection device and a defect detection device, allowing it to identify and address issues in the steel strips effectively. The control unit of the equipment features multiple modes, including a first cut mode for laser cutting near the joint portion and a second cut mode for cutting near defective portions. This innovative design aims to improve the production process of steel strips.

Conclusion

Manabu Harazono's work in developing cutting equipment for steel strips showcases his commitment to innovation in the manufacturing industry. His contributions have the potential to enhance production efficiency and quality in steel processing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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