Man Lung Ivan Sham

Title: Inventor Profile: Man Lung Ivan Sham

Introduction

Man Lung Ivan Sham is an innovative inventor based in Hong Kong SAR, China. With a total of two patented inventions to his name, he has made significant contributions to the fields of vehicle technology and semiconductor packaging. His work reflects a commitment to advancing technology and improving existing systems.

Latest Patents

Man Lung Ivan Sham's latest patents include a groundbreaking "Method and apparatus for identification of wheels of a vehicle" and a "Multi-chip package." The first patent focuses on determining the location information of multiple wheels mounted on a vehicle. It does so by establishing a relationship between the lateral location of a wheel and the polarity of transverse acceleration transmitted by an accelerometer. This technology helps accurately identify wheel positions during lateral turns, enhancing vehicle safety and performance.

The second patent, the "Multi-chip package," pertains to semiconductor device packaging that can be utilized in applications such as tire pressure monitoring systems. This innovation aims to improve the efficiency and functionality of electronic systems in vehicles, demonstrating Ivan Sham's impact on automotive technology.

Career Highlights

In his professional journey, Man Lung Ivan Sham is associated with the Hong Kong Applied Science and Technology Research Institute Company, Limited. Through this position, he has been able to collaborate with leading experts in the field and contribute to cutting-edge research and development initiatives.

Collaborations

Throughout his career, Ivan Sham has collaborated with notable coworkers, including Ziyang Gao and Kwan Wai Raymond To. These collaborations have fostered an environment of creativity and innovation, allowing them to collectively push the boundaries of technology and engineering.

Conclusion

Man Lung Ivan Sham's contributions as an inventor are noteworthy, especially in the areas of vehicle wheel identification and semiconductor packaging. His patents showcase not only his innovative mindset but also his dedication to enhancing the functionality and safety of vehicles. As he continues to work at the Hong Kong Applied Science and Technology Research Institute Company, Limited, the future promises even more exciting developments from this talented inventor.