This inventor holds 1 USPTO granted patent. Top assignee: Broadcom Corporation. Active years: 2008.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2008
Title: Malcolm MacIntosh - Innovator in Wafer-Level Flip Chip Packaging
Introduction
Malcolm MacIntosh is a distinguished inventor based in Escondido, California, known for his contributions to the field of semiconductor packaging. With a focus on innovative solutions, he has developed technologies that enhance the performance and reliability of integrated circuits.
Latest Patents
Malcolm holds a patent for a "Wafer-level flipchip package with IC circuit isolation." This invention involves forming a wafer-level chip scale flip chip package by determining the isolation requirements of an integrated circuit formed in a semi-conductive substrate from package signal connections. The operation includes selecting the thickness of dielectric layers, determining the minimum pitch of package signal connections, and establishing the position of servicing package signal connections based on integrated circuit characteristics.
Career Highlights
Malcolm MacIntosh has made significant strides in his career, particularly through his work at Broadcom Corporation. His expertise in semiconductor technology has positioned him as a key player in the development of advanced packaging solutions.
Collaborations
Throughout his career, Malcolm has collaborated with talented professionals, including Arya Behzad and Matthew Vernon Kaufmann. These partnerships have fostered innovation and contributed to the success of various projects within the semiconductor industry.
Conclusion
Malcolm MacIntosh's work exemplifies the spirit of innovation in the technology sector. His contributions to wafer-level flip chip
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile