Uplyme, United Kingdom

Malcolm Graham

This inventor holds 1 USPTO granted patent. Top assignee: Henkel Corporation. Active years: 2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Malcolm Graham. Retrieved from https://idiyas.com/inventor/malcolm-graham-vsk3m5am

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2012

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1 patent (USPTO):Explore Patents

Title: The Innovations of Malcolm Graham

Introduction

Malcolm Graham is a notable inventor based in Uplyme, GB. He has made significant contributions to the field of adhesives, particularly with his innovative approach to reactive hot melt adhesives. His work has garnered attention for its unique formulation and application.

Latest Patents

Malcolm Graham holds a patent for a reactive hot melt adhesive that is solvent-free and moisture-curable. This adhesive is prepared using an oxazolidine functional prepolymer combined with a polyfunctional isocyanate. His invention represents a significant advancement in adhesive technology, providing environmentally friendly options for various applications.

Career Highlights

Malcolm is currently employed at Henkel Corporation, a leading company in the adhesive industry. His role at Henkel allows him to further develop his innovative ideas and contribute to the company's extensive portfolio of adhesive solutions. With 1 patent to his name, he continues to push the boundaries of adhesive technology.

Collaborations

Malcolm collaborates with Andrew Slark, a fellow innovator at Henkel Corporation. Their partnership fosters a creative environment that encourages the development of new adhesive technologies.

Conclusion

Malcolm Graham's contributions to the field of adhesives highlight his innovative spirit and commitment to advancing technology. His work not only benefits the industry but also sets a precedent for future developments in adhesive solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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