Makoto Ebata

Title: Makoto Ebata: Innovator in Film Thickness Measurement and Alloy Development

Introduction

Makoto Ebata is a prominent inventor based in Tokyo, Japan, known for his contributions to the fields of film thickness measurement and alloy development. With a total of eight patents to his name, he has made significant advancements that have practical applications in various industries.

Latest Patents

One of his latest patents is a film thickness measuring monitor wafer. The objective of this invention is to provide a wafer structure that enables the practical use of silicon carbide (SiC) wafers for monitoring film thickness. The invention specifies that the average surface roughness Ra of at least one surface of the SiC wafer should be substantially equivalent to the film thickness of a film deposited on a silicon (Si) wafer. This innovation allows for a hard and chemically resistant film thickness measuring wafer that can be used semi-permanently, reducing polishing costs significantly. Another notable patent involves an iron-based alloy with low contents of aluminum, silicon, magnesium, calcium, oxygen, sulfur, and nitrogen, which is designed to enhance the properties of iron while maintaining minimal carbon content.

Career Highlights

Throughout his career, Makoto Ebata has worked with notable companies such as Mitsui Engineering and Shipbuilding Company Limited and Metal Research Corporation. His experience in these organizations has contributed to his expertise in material science and engineering.

Collaborations

Makoto has collaborated with several professionals in his field, including Tohei Ototani and Toru Degawa. Their joint efforts have furthered the development of innovative technologies and materials.

Conclusion

Makoto Ebata's work in film thickness measurement and alloy development showcases his innovative spirit and dedication to advancing technology. His contributions have the potential to impact various industries positively.