Makio Okada

Title: The Innovations of Makio Okada

Introduction

Makio Okada is a prominent inventor based in Hyogo, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on enhancing the performance and reliability of semiconductor devices.

Latest Patents

One of Okada's latest patents is for a land grid array semiconductor device. This invention provides greater positioning accuracy for an external electrode with respect to a mounting substrate. The external electrodes are arranged on one surface of the substrate in an area array. Each external electrode pad consists of a first pad layer with a cylindrical shape and a second pad layer that covers the surface of the first pad layer, featuring a conical shape.

Another notable patent is related to a leadframe. This invention addresses the issue of distortion or warpage of the leadframe due to differences in the coefficients of thermal expansion between the leadframe and a sealing resin. The design includes slits around the semiconductor device forming area to absorb these distortions. Additionally, positioning holes are provided on the inner portion of the leadframe near the tie bars, which helps limit shifting of the outer leads and prevents cutting during the tie bar cutting process.

Career Highlights

Makio Okada is associated with Mitsubishi Electric Corporation, where he has been instrumental in advancing semiconductor technologies. His innovative designs have contributed to the efficiency and effectiveness of various electronic devices.

Collaborations

Okada has collaborated with notable colleagues such as Yasushi Kasatani and Tomoaki Hashimoto. Their combined expertise has fostered a productive environment for innovation within their field.

Conclusion

Makio Okada's contributions to semiconductor technology through his patents demonstrate his commitment to innovation and excellence. His work continues to influence the industry and pave the way for future advancements.