Mai Susa

Title: Mai Susa - Innovator in Lead-Free Solder Technology

Introduction

Mai Susa is a prominent inventor based in Tokyo, Japan. He is known for his significant contributions to the field of solder technology, particularly in developing environmentally friendly solder alloys. His innovative work focuses on creating lead-free and antimony-free solder solutions that meet the demands of modern electronics.

Latest Patents

Mai Susa holds a patent for a lead-free and antimony-free solder alloy, solder ball, ball grid array, and solder joint. This invention provides a solder alloy with a medium-low melting point, ensuring solderability even after prolonged exposure to high temperatures. The alloy composition consists of 12 to 23% by mass of indium (In) and 0.001 to 0.08% by mass of germanium (Ge), with the balance being tin (Sn) and unavoidable impurities. The preferred composition includes 16 to 21% by mass of In and 0.005 to 0.01% by mass of Ge, while maintaining strict limits on impurities such as uranium (U), thorium (Th), arsenic (As), and lead (Pb).

Career Highlights

Mai Susa is currently employed at Senju Metal Industry Co., Ltd., where he continues to advance solder technology. His work has been instrumental in promoting the use of safer materials in electronic manufacturing. With a focus on innovation, he has contributed to the development of products that align with global environmental standards.

Collaborations

Mai Susa collaborates with Takashi Saito, a fellow innovator in the field. Together, they work on projects that aim to enhance the performance and sustainability of solder materials.

Conclusion

Mai Susa's contributions to lead-free solder technology represent a significant advancement in the electronics industry. His innovative approach not only addresses technical challenges but also promotes environmental sustainability.