Wako, Japan

Mai Sekikawa

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Honda Motor Co., Ltd.. Active years: 2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mai Sekikawa. Retrieved from https://idiyas.com/inventor/mai-sekikawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

 

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: Mai Sekikawa: Vehicle Safety Innovation

Introduction

Mai Sekikawa is an inventor associated with Wako, Japan, and Honda Motor Co., Ltd. Her patent work addresses vehicle design, with a focus on the behavior of a front hood during a collision.

Latest Patents

Sekikawa is credited with 1 patent, titled “Vehicle Front Hood Structure.” The design uses a center bead, front radiating beads, and rear radiating beads in the hood frame. These features are intended to help the hood bend into an inverted V shape under frontal crash loads, while providing the stiffness needed for normal use. The structure also aims to control downward deformation under a downward load and support an appropriate head injury criterion (HIC) level.

Career Highlights

Sekikawa’s listed patent reflects work on balancing structural stiffness with controlled deformation in a vehicle front hood. This balance is relevant to vehicle safety design, where components must meet functional requirements while responding appropriately to impact forces.

Collaborations

The patent information identifies Honda Motor Co., Ltd. as Sekikawa’s company and Masato Ishibashi as a coworker associated with the work.

Conclusion

Mai Sekikawa’s patent on a vehicle front hood structure illustrates an approach to combining hood-frame stiffness with controlled deformation during impact, contributing to Honda’s vehicle-safety engineering work.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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