Katraj, India

Mahesh Chakorkar

This inventor holds 1 USPTO granted patent. Top assignee: Magna Exteriors Gmbh. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mahesh Chakorkar. Retrieved from https://idiyas.com/inventor/mahesh-chakorkar

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Mahesh Chakorkar and a Liftgate Bonding Structure

Introduction

Mahesh Chakorkar is an inventor associated with Katraj, India. His patent work includes a liftgate bonding structure designed to improve how metallic reinforcements are joined to mating panels.

Latest Patents

The provided information lists one patent for Chakorkar. The invention, titled “Bonding Structure Efficiently,” describes a liftgate with metallic reinforcements featuring strategically positioned flanges, openings, notches, slots, holes, steps, or adhesive gaps. These features allow adhesive applied to outer panels or glass to flow around and through the reinforcements, bonding them to mating panels from multiple sides. Adhesive can also be mechanically captured through openings, holes, and slots, including within undercut pockets in the mating parts.

Career Highlights

Chakorkar is associated with Magna Exteriors GmbH. His listed patent focuses on a practical approach to strengthening adhesive bonds in liftgate assemblies by combining adhesive flow with mechanical capture.

Collaborations

The provided information identifies Yao Wang and Tejaswi Vemuri as Chakorkar’s coworkers. Their names are included as professional associations, though no specific joint patent work is described.

Conclusion

Mahesh Chakorkar’s listed invention addresses liftgate assembly by using strategically designed reinforcement features to support adhesive bonding and mechanical retention.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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