Greenwood, SC, United States of America

Mahendra N Desai

This inventor holds 1 USPTO granted patent. Top assignee: Automation Industries, Inc.. Active years: 1982.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mahendra N Desai. Retrieved from https://idiyas.com/inventor/mahendra-n-desai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 1982

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1 patent (USPTO):Explore Patents

Title: Mahendra N Desai: Innovator in Thermoplastic Compositions

Introduction

Mahendra N Desai is a notable inventor based in Greenwood, SC, who has made significant contributions to the field of thermoplastic compositions. With a focus on materials that offer high stability and flame resistance, his work is essential in various industrial applications.

Latest Patents

Desai holds a patent for thermoplastic compositions that contain polyvinylidene fluoride. This patent describes compositions that can be formed into flexible films, which are particularly useful as laminates for webs employed in conditions requiring durability and flame resistance.

Career Highlights

Desai is associated with Automation Industries, Inc., where he applies his expertise in developing innovative materials. His work has led to advancements in the use of thermoplastic compositions in various applications.

Collaborations

Some of his coworkers include Thomas A Kutnyak and Roy A Berman, who contribute to the collaborative environment at Automation Industries, Inc.

Conclusion

Mahendra N Desai's contributions to thermoplastic compositions highlight his role as an innovator in the field, showcasing the importance of his work in enhancing material performance.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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