Penacook, NH, United States of America

Mackenzie Reed Burton-Williams

This inventor holds 1 USPTO granted patent. Top assignee: Summit Packaging Systems, Inc.. Active years: 2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Mackenzie Reed Burton-Williams. Retrieved from https://idiyas.com/inventor/mackenzie-reed-burton-williams

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Mackenzie Reed Burton-Williams: Innovator in Actuator Technology

Introduction

Mackenzie Reed Burton-Williams is a talented inventor based in Penacook, NH (US). She has made significant contributions to the field of actuator technology. With a focus on innovation, Mackenzie has developed a patent that showcases her expertise and creativity.

Latest Patents

Mackenzie holds a patent for an actuator, which highlights her ability to create solutions that meet industry needs. This patent represents her commitment to advancing technology and improving product functionality.

Career Highlights

Mackenzie is currently employed at Summit Packaging Systems, Inc., where she applies her skills and knowledge to develop innovative packaging solutions. Her work at this company has allowed her to make a meaningful impact in the industry.

Collaborations

Mackenzie collaborates with talented coworkers, including Jason Craig Campbell and Marcel Thomas Faucher. These partnerships enhance her work and contribute to the success of their projects.

Conclusion

Mackenzie Reed Burton-Williams is a remarkable inventor whose contributions to actuator technology and packaging solutions are noteworthy. Her dedication to innovation and collaboration continues to drive her success in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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