Company Filing History:
Years Active: 2017-2018
Title: Ma Shirley Asoy: Innovator in Wafer Level Packaging Technology
Introduction: Ma Shirley Asoy is a distinguished inventor based in High Point, North Carolina, recognized for her contributions to the field of integrated circuit technology. With a remarkable portfolio of two patents, Asoy has made significant advancements, particularly in the area of electromagnetic shielding in wafer level fan-out packaging.
Latest Patents: Asoy’s recent innovations include groundbreaking patents focused on wafer level fan-out with electromagnetic shielding. The first patent details an integrated circuit module that incorporates electromagnetic shielding, featuring a die with an input/output (I/O) port, partially encapsulated by a mold compound. This design ensures that the I/O port remains accessible while integrating a redistribution structure with a shield connected element that extends beyond the die.
The second patent similarly advances on this theme by integrating shielding into a wafer level fan-out packaging process. Asoy utilizes a mold wafer containing multiple modules, each featuring a die with an I/O port. By implementing a redistribution structure that connects to the I/O port and extends into the inter-module area, Asoy effectively creates a shielding structure that enhances the functionality and reliability of electronic components.
Career Highlights: Asoy is currently employed at Qorvo US, Inc., a forward-thinking company at the forefront of communication solutions. Her innovative approach and technical expertise have positioned her as a key contributor to the development of advanced technology in the semiconductor industry.
Collaborations: Throughout her career, Asoy has collaborated with esteemed colleagues such as Thong Dang and Dan Carey. These partnerships have fostered a dynamic environment for innovation and have contributed to the successful development and refinement of her patented technologies.
Conclusion: Ma Shirley Asoy’s work exemplifies the spirit of innovation and excellence in the field of integrated circuits. With her patents on wafer level fan-out technology and electromagnetic shielding, she continues to shape the future of electronic design and manufacturing. Her contributions are not only a testament to her skills as an inventor but also highlight the collaborative efforts that drive advancements in technology.