Loveland, CO, United States of America

M Douglas Rutledge

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Cortek, Inc.. Active years: 2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: M Douglas Rutledge. Retrieved from https://idiyas.com/inventor/m-douglas-rutledge

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 1.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: M Douglas Rutledge: Innovator in Load-Bearing Systems

Introduction

M Douglas Rutledge is a notable inventor based in Loveland, Colorado. He has made significant contributions to the field of construction and materials engineering. His innovative approach focuses on enhancing the efficiency of fill material structures.

Latest Patents

Rutledge holds a patent for a "Load-bearing system for fill material structure formation." This invention encompasses methods and apparatus for creating structures using fill materials that can harden, such as concrete. The techniques he developed aim to improve load-bearing capabilities, resulting in substantial efficiencies in time, labor, materials, and costs associated with fill material formation. His methods are particularly well-suited for manufacturing and prefabrication processes.

Career Highlights

M Douglas Rutledge is associated with Cortek, Inc., where he applies his expertise in developing innovative construction solutions. His work has been instrumental in advancing the capabilities of load-bearing systems, making a lasting impact on the industry.

Collaborations

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Conclusion

M Douglas Rutledge's contributions to load-bearing systems exemplify the importance of innovation in construction technology. His patent reflects a commitment to improving efficiency and effectiveness in the use of fill materials.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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