This inventor holds 1 USPTO granted patent. Top assignees: Chongqing Jiepin Technology Co., Ltd, Chongqing University. Active years: 2022.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2022
Title: Lvfeng Yang: Innovator in Hot-Forging Die Technology
Introduction
Lvfeng Yang is a notable inventor based in Chongqing, China. He has made significant contributions to the field of hot-forging die technology. His innovative approach has led to the development of a unique patent that addresses critical challenges in the manufacturing process.
Latest Patents
Lvfeng Yang holds a patent for a "Hot-forging die with conformal meshy structured cavity surface layer and preparation method thereof." This invention discloses a hot-forging die that features a conformal meshy structured cavity surface layer. The design includes a die substrate with a sandwiched layer, a transition layer, and a reinforcement layer formed sequentially. The grooves in the reinforcement and transition layers create a meshy structure that enhances the die's performance. This innovative design helps to mitigate hot cracks during the welding process and under service conditions, ensuring durability and reliability.
Career Highlights
Throughout his career, Lvfeng Yang has worked with prominent organizations, including Chongqing Jiepin Technology Co., Ltd and Chongqing University. His experience in these institutions has allowed him to refine his skills and contribute to advancements in engineering and manufacturing.
Collaborations
Lvfeng Yang has collaborated with esteemed colleagues such as Jiansheng Zhang and Qian Zhang. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
Lvfeng Yang's contributions to hot-forging die technology exemplify the spirit of innovation. His patented designs not only enhance manufacturing processes but also address critical challenges in the industry. His work continues to inspire future advancements in engineering.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile