Company Filing History:
Years Active: 2010
Title: Lutz Schräpler: Innovator in Copper Bonding Technology
Introduction
Lutz Schräpler, based in Karlstein, Germany, is an accomplished inventor known for his contributions to the field of bonding technologies. With a focus on enhancing the properties of copper, Schräpler has developed innovative methods that improve both bonding and corrosion resistance in wires.
Latest Patents
Schräpler holds a patent for a unique bonding or superfine wire made of copper, distinguished by its gold enrichment on the surface. This development is particularly significant as it allows for a coating of up to 50 nm of gold, providing enhanced durability. The wire, typically connected using the ball/wedge method, exhibits a copper-colored appearance and achieves a desired hardness of less than 95 according to HV0.002 after flame-off. To create this effective bonding or superfine wire, gold or a copper-gold alloy is introduced either as a coating or integrated into the surface of the copper wire itself. This wire technology is particularly suited for bonding to semiconductor silicon chips, marking a vital step forward in electronic component manufacturing.
Career Highlights
Lutz Schräpler is currently employed at W.C. Heraeus GmbH, where he continues to influence advancements in materials science and engineering. His expertise in metal bonding has positioned him as a key figure within the company, contributing to its reputation for innovation in the technology sector.
Collaborations
Throughout his career, Schräpler has worked alongside talented colleagues such as Albrecht Bischoff and Heinz Förderer. Their collective efforts in research and development have propelled the advancements in bonding technologies and have brought significant recognition to their work in the industry.
Conclusion
In conclusion, Lutz Schräpler's innovations in copper bonding technology reflect his dedication to advancing electronic manufacturing processes. With a patented invention that exhibits exceptional qualities and his collaborative spirit with other prominent engineers, Schräpler continues to play a crucial role in shaping the future of materials science.