The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 12, 2010
Filed:
Sep. 07, 2007
Albrecht Bischoff, Bruchköbel, DE;
Heinz Förderer, Groβkrotsenburg, DE;
Lutz Schräpler, Karlstein, DE;
Frank Krüger, Bruchköbel, DE;
Albrecht Bischoff, Bruchköbel, DE;
Heinz Förderer, Groβkrotsenburg, DE;
Lutz Schräpler, Karlstein, DE;
Frank Krüger, Bruchköbel, DE;
W.C. Heraeus GmbH, Hanau, DE;
Abstract
A bonding or superfine wire is provided made of copper, with a gold enrichment on the surface thereof, in particular in an amount corresponding to a coating of at most 50 nm. The wire may be bonded by the ball/wedge method, has a copper-colored appearance, and the ball thereof after flame-off has a hardness of less than 95 according to HV0.002. In order to produce the bonding or superfine wire, a copper wire is coated with gold or a copper-gold alloy or gold is introduced into the surface of the copper wire. The wires are bonded to a semiconductor silicon chip.