Location History:
- Bruchkobel, DE (1982 - 1985)
- Bruchkobel-Oberissigheim, DE (1986)
- Bruchköbel, DE (2010)
Company Filing History:
Years Active: 1982-2010
Title: Albrecht Bischoff: Innovator in Copper Bonding Technologies
Introduction
Albrecht Bischoff is a notable inventor based in Bruchkobel, Germany. He has made significant contributions to the field of materials science, particularly in the development of advanced bonding technologies. With a total of 6 patents to his name, Bischoff's work has had a considerable impact on the semiconductor industry.
Latest Patents
One of Bischoff's latest patents is focused on a copper bonding or superfine wire with improved bonding and corrosion properties. This innovative wire is made of copper and features a gold enrichment on its surface, specifically designed to enhance its performance. The wire can be bonded using the ball/wedge method and exhibits a copper-colored appearance. After flame-off, the ball has a hardness of less than 95 according to HV0.002. The production process involves coating a copper wire with gold or a copper-gold alloy, allowing for effective bonding to semiconductor silicon chips.
Another significant patent is for a multi-layer electrical support substrate. This invention addresses the issue of defoliation or splitting-off of aluminum or aluminum alloy that is roll-plated on a copper or copper alloy base. To mitigate this problem, an intermediate nickel layer with less than 0.05% contaminants is applied beneath the aluminum layer. If the base is a copper alloy, an intermediate oxygen-free copper layer is placed between the base and the nickel layer. The typical dimensions of the layers are carefully specified to ensure optimal performance.
Career Highlights
Throughout his career, Albrecht Bischoff has worked with prominent companies in the industry, including W.C. Heraeus GmbH and Heraeus Quarzschmelze GmbH. His experience in these organizations has allowed him to refine his expertise in materials and bonding technologies.
Collaborations
Bischoff has collaborated with notable colleagues such as Fritz Aldinger and Richard Keilberth. These partnerships have contributed to the advancement of his research and innovations in the field.
Conclusion
Albrecht Bischoff's contributions to copper bonding technologies and materials science have established him as a key figure in the industry. His innovative patents and collaborations reflect his commitment to advancing technology in the semiconductor sector.