Charlotte, NC, United States of America

Luther B Caldwell

This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 1986.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Luther B Caldwell. Retrieved from https://idiyas.com/inventor/luther-b-caldwell

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 1986

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1 patent (USPTO):Explore Patents

Title: Luther B. Caldwell and Integrated Circuit Interconnections.

Introduction

Luther B. Caldwell is an inventor associated with Charlotte, North Carolina, and International Business Machines Corporation. His documented patent concerns conserving space when connecting elements on an integrated-circuit substrate.

Latest Patents

Caldwell’s listed patent is “Interconnection of Elements on Integrated Circuit Substrate—Concentric Patterns of Cells or Macros.” It describes arranging macros on a first metal level and conductive lines on a second metal level, allowing the substrate’s space to be used efficiently. The second metal level may also include concentric patterns of power and ground buses. Caldwell is credited with 1 patent in the information provided.

Career Highlights

The available information associates Caldwell’s work with IBM and integrated-circuit design. His patent focuses on the organization of conductive layers and circuit elements to conserve substrate area.

Collaborations

Bradford Dunham and Michael F. Crocetti are identified as Caldwell’s coworkers.

Conclusion

Luther B. Caldwell’s documented contribution is a patented approach to arranging macros, conductive lines, and power and ground buses across two metal levels to conserve space on an integrated-circuit substrate.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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