Luping Huang

Title: Innovations of Luping Huang

Introduction

Luping Huang is a notable inventor based in Dublin, California, who has made significant contributions to the field of wafer technology. With a total of four patents to his name, Huang's work focuses on methods and systems that enhance the efficiency and effectiveness of wafer handling.

Latest Patents

Huang's latest patents include "Methods and systems for chucking a warped wafer" and "Apparatus and method for chucking warped wafers." The first patent presents innovative methods for vacuum mounting a warped, thin substrate onto a flat chuck. This vacuum chuck features three or more collapsible bellows that engage with the warped substrate, sealing and vacuum clamping onto its backside surface. The bellows can collapse by at least five hundred micrometers during the clamping process. Additionally, an extensible sealing element is integrated into a recessed annular channel on the chuck body, extending at least five millimeters to ensure a secure fit as the substrate is evacuated. The second patent describes an apparatus for fixing a wafer, which includes a chuck with a surface, multiple through bores, a fixed vacuum bellows, and floating air bearings. This design allows for precise control and stability when handling wafers.

Career Highlights

Luping Huang is currently employed at Kla Tencor Corporation, where he continues to innovate in the field of semiconductor manufacturing. His work has been instrumental in advancing technologies that improve wafer processing and handling.

Collaborations

Huang collaborates with talented colleagues such as Aviv Balan and Savita Chandan, contributing to a dynamic team focused on cutting-edge developments in wafer technology.

Conclusion

Luping Huang's contributions to wafer technology through his patents and work at Kla Tencor Corporation highlight his role as a significant inventor in the field. His innovative methods and systems are paving the way for advancements in semiconductor manufacturing.