Philadelphia, PA, United States of America

Luke G Warpinski

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: The Boeing Company. Active years: 2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Luke G Warpinski. Retrieved from https://idiyas.com/inventor/luke-g-warpinski

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Innovations by Luke G Warpinski

Introduction

Luke G Warpinski is an accomplished inventor based in Philadelphia, PA. He is known for his innovative contributions to the field of tooling in layered structures. His work focuses on enhancing joint performance through advanced methods and apparatus.

Latest Patents

Luke G Warpinski holds a patent titled "Methods and apparatus for tooling in layered structures for increased joint performance." This patent describes a method that includes placing a tool onto a first substrate to define an impression, curing the substrate, and then removing the tool to create a joint interface. This innovative approach allows for the coupling of the first substrate to a second substrate at the joint interface.

Career Highlights

Luke is currently employed at The Boeing Company, where he applies his expertise in engineering and innovation. His work contributes significantly to the development of advanced aerospace technologies.

Collaborations

Luke has collaborated with notable colleagues, including Michael D Nevinsky and Kenneth Walter Young. Their combined efforts in research and development have led to significant advancements in their respective fields.

Conclusion

Luke G Warpinski's innovative work in tooling methods has made a notable impact in the aerospace industry. His patent reflects a commitment to improving joint performance in layered structures, showcasing his dedication to engineering excellence.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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