Company Filing History:
Years Active: 2024-2025
Title: Innovations by Inventor Luis Maier
Introduction
Luis Maier is a notable inventor based in Munich, Germany. He has made significant contributions to the field of technology, particularly in the area of packaging solutions for electronic devices. With a total of 2 patents to his name, Maier's work reflects a commitment to advancing the capabilities of modern electronics.
Latest Patents
Maier's latest patents include innovative solutions that enhance the design and functionality of electronic packages. The first patent, titled "Wafer Level Package," proposes a full-cover package solution that combines copper pillars or solder bumps with acoustic cavities. This design maximizes the usable design area compared to existing thin film acoustic wafer level packages. The manufacturing process can be executed through a self-aligned interconnection method, which streamlines production.
The second patent, "Package Comprising Stacked Filters," describes a package that integrates a first filter device and a second filter device. The first filter device features a substrate made of a first piezoelectric material, along with a metal layer attached to its surface. The second filter device similarly includes a substrate of a second piezoelectric material and a corresponding metal layer. This package is designed with pillar interconnects that facilitate electrical connections between the filter devices, enhancing their performance.
Career Highlights
Luis Maier is currently employed at Rf360 Singapore Pte. Ltd., where he continues to innovate and develop advanced packaging technologies. His work has positioned him as a key player in the electronics industry, contributing to the evolution of device packaging.
Collaborations
Throughout his career, Maier has collaborated with talented individuals such as Robert Felix Bywalez and Ilya Lukashov. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.
Conclusion
Luis Maier's contributions to the field of electronic packaging are noteworthy and demonstrate his innovative spirit. His patents reflect a deep understanding of technology and a commitment to improving electronic device performance. As he continues his work at Rf360 Singapore Pte. Ltd., the impact of his inventions will likely resonate throughout the industry for years to come.