The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2025
Filed:
Oct. 30, 2020
Applicant:
Rf360 Singapore Pte. Ltd., Republic Plaza, SG;
Inventors:
Robert Felix Bywalez, Munich, DE;
Karl Nicolaus, Zorneding, DE;
Ilya Lukashov, Munich, DE;
Luis Maier, Munich, DE;
Assignee:
RF360 Singapore Pte. Ltd., Republic Plaza, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 9/02 (2006.01);
U.S. Cl.
CPC ...
H03H 9/02574 (2013.01); H03H 9/02992 (2013.01);
Abstract
A fullcover package solution in combination with copper pillars or solder bumps and acoustic cavities is proposed to provide maximum usable design area compared to current thin film acoustic wafer level packages. Manufacturing can be done in a self-aligned interconnection process.