This inventor holds 1 USPTO granted patent. Top assignee: Dow Global Technolgoies LLC. Active years: 2018.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2018
Title: Innovations by Luis G Zalemea Bustillo
Introduction
Luis G Zalemea Bustillo is an accomplished inventor based in Richterswil, Switzerland. He has made significant contributions to the field of fluid conveyance through his innovative patent. His work focuses on enhancing the bonding processes between various means of conveying fluids, showcasing his expertise in materials science.
Latest Patents
Luis G Zalemea Bustillo holds a patent for a composition, connector, and process aimed at improving bonding between two or more means for conveying fluids. The patent describes a composition that includes a thermoplastic polymer and a plurality of particles with a core-shell structure. The core consists of one or more magnetic materials, while the shell is made of silicon dioxide. The composition is designed to contain these particles in an amount ranging from 2 to 15 wt %. This invention not only provides a novel connector but also outlines a system for conveying fluids effectively.
Career Highlights
Luis is currently associated with Dow Global Technologies LLC, where he applies his expertise in developing innovative solutions for fluid conveyance. His work has been instrumental in advancing technologies that improve the efficiency and reliability of fluid systems.
Collaborations
Luis has collaborated with notable professionals in his field, including Rudolf J Koopmans and Detlef Schramm. These collaborations have further enriched his research and development efforts, leading to impactful innovations.
Conclusion
Luis G Zalemea Bustillo's contributions to the field of fluid conveyance through his innovative patent demonstrate his commitment to advancing technology. His work continues to influence the industry and pave the way for future innovations.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
