Luis A Rivera

Title: The Innovative Spirit of Luis A. Rivera in Thermal Management

Introduction

Luis A. Rivera, an accomplished inventor based in Rochester, NY, has made significant contributions to the field of semiconductor technology. With a focus on enhancing thermal management within infrared imaging devices, Rivera's innovative solutions encapsulate the essence of modern engineering.

Latest Patents

Rivera holds a notable patent for his invention titled "Package and method for assembly of infra-red imaging devices." This invention addresses the challenges associated with the packaging of semiconductor chips. It offers a method that simplifies assembly while improving thermal dissipation from the chip. This is achieved by reducing stress in the chip due to differential thermal expansion between the chip and its package across temperature variations. The inventive packaging involves the use of an adhesive tape that covers the active area of the chip while exposing the bonding pads through a recess. A corresponding body with a similar recess supports the adhesive tape, allowing for wire bonds to connect the bonding pads to the chip, with a protective lid covering the recess to safeguard the wire bonds.

Career Highlights

Luis A. Rivera's career is closely tied with the Eastman Kodak Company, where he has been pivotal in advancing imaging technologies. His innovative mindset has led to the development of patented solutions that not only enhance product performance but also drive the evolution of the industry. His dedication to improving semiconductor packaging demonstrates his commitment to research and development.

Collaborations

Rivera has collaborated with notable colleagues such as William F. DesJardin and Edward J. Ozimek, enhancing the scope and impact of their collective work. Through teamwork and sharing of ideas, they have pushed the boundaries of current imaging technologies, leading to significant advancements in the field.

Conclusion

Luis A. Rivera exemplifies the role of an inventor dedicated to solving complex technical challenges. His patent for the packaging and method of assembly of infra-red imaging devices showcases a blend of creativity and practical application, contributing to advancements in semiconductor technology. With a commitment to innovation and collaborative spirit, Rivera continues to influence the landscape of modern engineering.