Medfield, MA, United States of America

Ludmilla Konopasek

This inventor holds 1 USPTO granted patent. Top assignee: Albany International Corporation. Active years: 1994.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ludmilla Konopasek. Retrieved from https://idiyas.com/inventor/ludmilla-konopasek

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 14(Granted Patents)


Company Filing History:


Years Active: 1994

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1 patent (USPTO):Explore Patents

Title: Ludmilla Konopasek: Innovator in Paper Machine Clothing

Introduction

Ludmilla Konopasek is a notable inventor based in Medfield, MA (US). She has made significant contributions to the field of paper machine clothing, particularly in high-temperature applications. Her innovative work has led to the development of a unique article that enhances the efficiency and durability of paper production processes.

Latest Patents

Ludmilla holds 1 patent for her invention related to paper machine clothing. This patent focuses on an article designed for use in high-temperature applications, showcasing her expertise in materials engineering and design.

Career Highlights

Ludmilla is currently employed at Albany International Corporation, a company known for its advanced solutions in the paper and textile industries. Her role at the company allows her to apply her innovative ideas and contribute to the development of cutting-edge technologies.

Collaborations

Ludmilla has worked alongside talented colleagues, including Maryann C Kenney and Sandra K Barlow. Their collaborative efforts have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Ludmilla Konopasek's contributions to the field of paper machine clothing exemplify her dedication to innovation and excellence. Her work continues to impact the industry positively, and her patent reflects her commitment to advancing technology in high-temperature applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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