Ludwigshafen, Germany

Lucas Benjamin Henderson

USPTO Granted Patents = 2 

 

Average Co-Inventor Count = 6.5

ph-index = 1


Company Filing History:


Years Active: 2022-2024

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2 patents (USPTO):Explore Patents

Title: Innovations of Lucas Benjamin Henderson

Introduction

Lucas Benjamin Henderson is an accomplished inventor based in Ludwigshafen, Germany. He has made significant contributions to the field of electroplating, particularly with cobalt compositions. With a total of 2 patents to his name, Henderson's work is recognized for its innovative approaches to enhancing plating processes.

Latest Patents

Henderson's latest patents include a composition for cobalt plating that comprises an additive for void-free submicron feature filling. This invention describes a composition that includes metal ions, primarily cobalt ions, along with a specific monomeric and polymeric suppressing agent. The suppressing agent features carboxylic, sulfonic, sulfinic, phosphonic, or phosphinic acid functional groups, which are essential for achieving void-free bottom-up filling of nanometer-sized recessed features. Another notable patent is for a cobalt electroplating composition that includes leveling agents. This composition consists of cobalt ions and specific leveling agents with various functional groups, designed to improve the quality of the electrodeposition process.

Career Highlights

Henderson is currently employed at BASF SE Corporation, where he continues to develop innovative solutions in the field of electroplating. His expertise and contributions have positioned him as a key figure in his area of specialization.

Collaborations

Henderson collaborates with talented professionals such as Charlotte Emnet and Dieter Mayer, who contribute to the innovative environment at BASF SE Corporation.

Conclusion

Lucas Benjamin Henderson's work in cobalt plating compositions showcases his commitment to innovation in electroplating technology. His patents reflect a deep understanding of the complexities involved in achieving high-quality plating processes.

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