Neu-Ulm, Germany

Luca Bumb

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Reinz-Dichtungs Gmbh. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Luca Bumb. Retrieved from https://idiyas.com/inventor/luca-bumb

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Luca Bumb: Inventor of an Acoustic Cover for Electric Drive Systems.

Introduction

Luca Bumb is an inventor associated with Neu-Ulm, Germany, and Reinz-Dichtungs GmbH. His work includes an invention addressing noise generated by components of electric drive systems.

Latest Patents

Bumb is credited with 1 patent, titled “Covering for a Component of an Electrical Drive System.” The patent describes a cover, such as a casing, designed to absorb high-frequency noise produced by electric motors and inverters. These components can generate disruptive sounds, including frequencies between 6 kHz and 12 kHz, due to their switching elements. The proposed cover is intended to reduce noise escaping to the exterior while remaining cost-effective and suitable for placement close to the motor and its components.

Career Highlights

Bumb’s listed patent work focuses on practical noise reduction for electric drive systems. The invention addresses an engineering challenge relevant to electric motors and their associated electronics.

Collaborations

Bumb is associated with Reinz-Dichtungs GmbH. Brian Heath is identified as a coworker; no further details about their collaboration are provided.

Conclusion

Luca Bumb’s patent presents a cost-conscious approach to reducing high-frequency noise from electric drive components, reflecting a focused contribution to electric-system design.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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