This inventor holds 1 USPTO granted patent. Top assignee: Smart Packaging Solutions. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Luc Lefebvre: Chip Card Antenna Innovation.
Introduction
Luc Lefebvre is an inventor based in Rousset, France, and works at Smart Packaging Solutions. His patent work focuses on chip card technology, particularly the design and production of optimized coupling antennas.
Latest Patents
Lefebvre is associated with 1 patent: “Chip Card with Optimized Coupling Antennas and Method for the Production Thereof.” The invention describes a contactless or mixed-contact chip card with an antenna insert placed between the card body’s outer layers. Coils on the insert’s substrate are designed to couple electromagnetically with the antenna coils of an electronic module. At least one inner coil extends into the module cavity and sits flush with its inner side walls.
Career Highlights
Lefebvre’s patent highlights his contribution to chip card antenna design and manufacturing. The disclosed approach integrates the antenna insert with the electronic module cavity to support electromagnetic coupling.
Collaborations
His listed coworkers include Guillaume Guerin and Stephan Danler Baumgartner.
Conclusion
Luc Lefebvre’s patent work at Smart Packaging Solutions centers on optimizing antenna coupling in chip cards through an integrated antenna insert design.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile