This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Infineon Technologies Ag. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Luay Kuan Ong: Innovator in Electronic Packaging Technology
Introduction
Luay Kuan Ong is a notable inventor based in Malacca, Malaysia. He has made significant contributions to the field of electronic packaging technology. His innovative approach has led to the development of a unique patent that enhances the functionality of electronic components.
Latest Patents
Luay Kuan Ong holds a patent for an "Encapsulated package with exposed electrically conductive structures and sidewall recess." This invention includes an electronic component that is encapsulated by an encapsulant. The design features a first electrically conductive structure on one side of the electronic component and a second electrically conductive structure on the opposing side. These structures are electrically coupled with the electronic component and are configured to operate at different electric potentials. The encapsulant also includes at least one sidewall recess, allowing the conductive structures to be exposed at opposing main surfaces.
Career Highlights
Luay Kuan Ong is associated with Infineon Technologies AG, a leading company in semiconductor solutions. His work at Infineon has allowed him to focus on advancing electronic packaging technologies. His innovative designs contribute to the efficiency and performance of electronic devices.
Collaborations
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Conclusion
Luay Kuan Ong's contributions to electronic packaging technology exemplify the impact of innovation in the field. His patent reflects a significant advancement that can enhance the performance of electronic components.