Louis T Mills

Title: Innovations of Louis T Mills

Introduction

Louis T Mills is an accomplished inventor based in Loveland, Colorado. He has made significant contributions to the field of integrated circuit packaging, holding a total of 4 patents. His work focuses on enhancing the reliability and performance of electronic devices through innovative packaging solutions.

Latest Patents

One of Mills' latest patents is a "Method for making integrated circuit packaging with reinforced leads." This invention involves an integrated circuit package that incorporates plastic or glass reinforcement of leads to increase lead rigidity, improve lead alignment and positional stability, and prevent bent leads. This method is particularly applicable to surface mount packages. For plastic packages, the reinforcement is formed during the molding of the plastic package. In metal packages, the plastic is molded as a separate operation. For ceramic packages with lead frames, glass may be formed separately or simultaneously with a glass seal for the ceramic package. The design allows for optional extended lead lengths, enabling plastic or glass to be formed on either side of the soldered foot area of each lead, without requiring changes to test fixtures or pick and place equipment.

Another notable patent is for an "Electronic device packaging assembly." This assembly includes a base member, a cover member, and a lead frame with multiple leads positioned between the base and cover members. An electronic device is placed between these components and is electrically attached to the leads. The assembly also features bonding rings for securing the base and cover members to the lead frame, along with spacers to maintain a predetermined spacing from the lead frame.

Career Highlights

Louis T Mills is currently employed at Hewlett-Packard Company, where he continues to innovate in the field of electronic packaging. His work has contributed to advancements in the reliability and efficiency of electronic devices.

Collaborations

Mills has collaborated with notable coworkers, including Richard M Butler and Havyn Eugene Bradley, who have also contributed to the field of electronic device packaging.

Conclusion

Louis T Mills is a prominent inventor whose work in integrated circuit packaging has led to significant advancements in electronic device reliability. His innovative patents reflect his commitment to improving technology in the electronics industry.